Editorial Board
Editor in Chief:
P. Ladevèze, Université Paris-Saclay, Ladeveze@ens-paris-saclay.fr
Associate Editors:
Francisco Chinesta, Ecole Centrale Nantes, France, Francisco.Chinesta@ec-nantes.fr
Ramon Codina, Universitat Politècnica de Catalunya, Spain, ramon.codina@upc.edu
Alberto Corigliano, Politecnico de Milano, Italy, alberto.corigliano@polimi.it
Elias Cueto, Universidad de Zaragoza, Spain, ecueto@unizar.es
Roger Ghanem, University of Southern California, USA, ghanem@usc.edu
Jörg Schröder, University Duisburg-Essen, Germany, j.schroeder@uni-due.de
Kenjiro Terada, Tohoku University , Japan, tei@irides.tohoku.ac.jp
Editorial Board:
O. Allix, ENS Cachan, France, allix@lmt.ens-cachan.fr
F. Armero, University of California at Berkeley, USA, armero@ce.berkeley.edu
F. Auricchio, University of Pavia, Italy, auricchio@unipv.it
T. Burczynski, Institute of Fundamental Technological Research, Polish Academy of Sciences, Poland, tburczynski@ippt.pan.pl
R. De Borst, University of Sheffield, UK, r.deborst@sheffield.ac.uk
C. Cartensen, Humboldt University of Berlin, Germany, cc@math.hu-berlin.de
A. Combescure, INSA Lyon, France, alain.combescure@insa-lyon.fr
E. Cueto, University of Zaragoza, Spain, ecueto@unizar.es
L. Demkowicz, University of Texas at Austin, USA, leszek@ices.utexas.edu
P. Diez, Polytecnical University of Cataluña, Spain, pedro.diez@upc.edu
J. Eberhardsteiner, Vienna Institute of Technology, Austria, ej@mail.tuwien.ac.at
C. Farhat, Stanford University, USA, cfarhat@stanford.edu
J. Fish, Columbia University, USA, fishj@columbia.edu
D. Givoli, Technion-Israel Institute of Technology, Israel, givolid@aerodyne.technion.ac.il
S. Ghosh, Johns Hopkins University, USA, sghosh20@jhu.edu
M. Geers, Technical University Eindhoven, The Netherlands, M.G.D.Geers@tue.nl
Ch. Hirsch, Numeca International, Belgium, charles.hirsch@numeca.be
A. Huerta, UPC, Spain, antonio.huerta@upc.edu
T. Hughes, University of Texas at Austin, USA, tjr_hughes@hotmail.com
N. D. Hung, University of Liège, Belgium, h.nguyendang@ulg.ac.be
A. Ibrahimbegovic, ENS Cachan, France adnan.ibrahimbegovic@utc.fr
S. Idelsohn, Polytecnical University of Cataluña, Spain sergio@cimne.upc.edu
P. Letallec, Ecole Polytechnique Palaiseau, France, patrick.letallec@polytechnique.fr
W. K. Liu, Northwestern University, USA, w-liu@northwestern.edu
Y. Maday, University Pierre et Marie Curie, France, Maday@ann.jussieu.fr
H. Mang, Vienna Institute of Technology, Austria, herbert.mang@tuwien.ac.at
H. Matthies, Technical University Braunschweig, Germany, wire@tu-braunschweig.de
N. Moes, Ecole Centrale Nantes, France, nicolas.moes@ec-nantes.fr
C. A. Mota Soares, University of Lisbon, Portugal, carlosmotasoares@dem.ist.utl.pt
T. Oden, University of Texas at Austin, USA, oden@ices.utexas.edu
R. Ohayon, CNAM Paris, France, roger.ohayon@cnam.fr
J. Oliver, Polytecnical University of Cataluña, Spain, oliver@cimne.upc.edu
E. Oñate, Polytecnical University of Cataluña, Spain, onate@cimne.upc.edu
M. Papadrakakis, University of Athens, Greece, mpapadra@central.ntua.gr
A. Patera, Massachusetts Institute of Technology, USA, patera@MIT.EDU
U. Perego, Polytechnical University of Milan, Italy, umberto.perego@polimi.it
G. Peric Swansea University, UK, D.Peric@swansea.ac.uk
E. Rank, Technical University Munich, Germany, ernst.rank@tum.de
S. Reese, RWTH Aachen University, Germany, stefanie.reese@rwth-aachen.de
K. Runesson, Chalmers University of Technology, Sweden, Kenneth.Runesson@chalmers.se
B. Schrefler, University of Padova, Italy, bernhard.schrefler@dicea.unipd.it
B. Sluys, Delft University of Technology, The Netherlands, L.J.Sluys@tudelft.nl
P. Steinmann, University of Erlangen, Germany, steinmann@ltm.uni-erlangen.de
W. Wall, Technical University Munich, Germany, wall@lnm.mw.tum.de
P. Wriggers, Leibniz University Hannover, Germany, wriggers@ikm.uni-hannover.de
G. Yagawa, University of Tokyo, Japan, yagawag@gmail.com
M. Yuan, Beijing University, China, yuanmw@pku.edu.cn
T. Zhodi, University of California, USA, zohdi@me.berkeley.edu
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- ISSN: 2213-7467 (electronic)