Fig. 21

Simulated microstructure distribution of \(\alpha _{\text {s}}\)- and \(\alpha _{\text {m}}\)-phases in the vertical center plane of the 10 cm - sided cube after 5000 s of cooling. The simulation used a thermal heat-transfer coefficient of \(\alpha _{\text {c}}=1000\ \frac{W}{m^2 K}\), a base-plate temperature of \(T_{\text {bp}}=300 \ K\) and a thermal contact resistance that is equivalent to an effective heat-transfer coefficient of \(\alpha _{\text {tc}}=5\cdot 10^5\ \frac{W}{m^2 K}\)